SE Close fram-0

Specifications

Materials
 Pin (outer sleeve) : Brass,machined, CuZn38Pb2
 Clip(contact 4 finger) : Beryllium copper,heat treated or PHBZ
 Plating(outer sleeve) : Tin plated : 2um/80u"nickel,5um/200u"Tin
 Gold plated: 2um/80u"nickel,full gold
 Plating clip(contact): 2um/80u"nickel,gold or tin plating
 Insulator body(housing) : Glass filled Hi-temperature thermoplastic UL94V-0

Electrical
 Current rating : 3 Amps/contact max.
 Contact resistance : ≦ 4mΩ /contact
 Insulation resistance : ≧ 10000MΩ at 500VAC
 Rated voltage : 100VRMS /150VDC 
 
Mechanical 
 Operating temperature : Gold plated: -55℃ to +105℃
 (Continuous) -67℉ to +105℉
 Tin plated: -40℃ to +105℃ 
 Average insertion force with steel pin of φ0.43mm/0.017" < 250g
 Average withdrawal force with steel pin of φ0.43mm/0.017" >50g
 Mechanical life : min.200

Application
 1.The open frame is most common type.
 2.The open body design gives better access (for cleaning and inspections) to air-cooling.
 3.Side and end stackable.
 4.High retention design prevents IC walkout during heavy vibration.
 5.Closed bottom sleeve for 100% anti-wicking of silder.
 6.Twist free construction.

Environmental data
 Solderability (IEC 60068-2-20. Ta) : 235℃, 2s 
 Resistance to soldering heat (IEC 60068-2-20. Tb) :
 -SMD mount components : 280℃, 10s

How to order