SD Single row

Specifications

Materials
 Pin (outer sleeve) : Brass,machined, CuZn38Pb2
 Clip(contact 4 finger) : Beryllium copper,heat treated or PHBZ
 Plating(outer sleeve) : Tin plated : 2um/80u"nickel,5um/200u"Tin
 Gold plated: 2um/80u"nickel,full gold
 Plating clip(contact): 2um/80u"nickel,gold or tin plating
 Insulator body(black) : Glass filled thermoplastic polyester UL94V-0

Electrical
 Current rating : 3 Amps/contact max.
 Contact resistance : ≦4mΩ /contact
 Insulation resistance : ≧10000MΩ at 500VAC
 Rated voltage : 100VRMS / 150VDC

Mechanical 
 Operating temperature : Gold plated: -55℃ to +125℃,
 (Continuous) -67℉ to +257℉
 Tin plated : -40℃ to +105℃
 Average insertion force with steel pin of φ0.43mm/0.017": < 250g
 Average withdrawal force with steel pin of φ0.43mm/0.017": >50g
 Mechanical life : min.200 

Application
 1.Common version for wire wrap IC-sockets.
 2.2 and 3 level standard/1 and 4 level optional Side and end stackable.
 3.Open frame version gives easier access to the PC Board and better air cooling.
 4.Side and stackable .Twist free construction.
 5.High retention design prevents IC walkout during heavy vibration.
 6.Pin design absolutely prevents 100% of the solder wicking and flux entrapment. 
 7.Twist free construction

Environmental data
 Solderability (IEC 60068-2-20. Ta) :235℃, 2s 
 Resistance to soldering heat (IEC 60068-2-20. Tb) :
 -Through hole mount components :260℃, 10s

How to order